Huawei's "Semiconductor Packaging" Patent Announcement
| AD |
According to Tianyancha, the "Semiconductor Packaging" patent of Huawei Technology Co., Ltd
According to Tianyancha, the "Semiconductor Packaging" patent of Huawei Technology Co., Ltd. was announced on October 31st, with the application publication number CN116982152A.
Image source: Tianyancha
The patent abstract shows that the present disclosure relates to a semiconductor packaging, which includes a first substrate, semiconductor chip, lead frame, and sealant. The lower main surface of the sealant includes a first part extending in the first plane, a second part extending in the second plane, a third part extending in the first transition zone between the first plane and the second plane, and a fourth part extending in the second transition zone between the second plane and at least one lead. The first part of the sealant and the lower main surface of the first substrate extend in the same first plane, forming the lower heat dissipation surface of the package. The dimensions of the second, third, and fourth parts of the sealant are set to maintain a first predefined minimum distance between the first part of the sealant and at least one lead.
Image source: Tianyancha
This article originates from Cailian News Agency
Disclaimer: The content of this article is sourced from the internet. The copyright of the text, images, and other materials belongs to the original author. The platform reprints the materials for the purpose of conveying more information. The content of the article is for reference and learning only, and should not be used for commercial purposes. If it infringes on your legitimate rights and interests, please contact us promptly and we will handle it as soon as possible! We respect copyright and are committed to protecting it. Thank you for sharing.(Email:[email protected])
| Mobile advertising space rental |
Tag: Huawei Semiconductor Packaging Patent Announcement
WeChat's "hidden rule": The social circle you post cannot be seen by others at all
NextWei Lai Li Bin Confirms About 10% Layoffs, Delays and Cuts Investment in Projects that Cannot Improve Financial Performance within 3 Years
Guess you like
- Detail
-
Apple iPhone 16 and Huawei Mate XT Tri-fold Phones Released on the Same Day: Who Will Win in a "Godly Battle" in Changsha Offline Stores?Detail
2024-09-21 16:18:55 1
- Detail
-
Has Your Personal Information Been Leaked? The Truth Behind Nuisance Calls and How to Protect YourselfDetail
2024-09-20 19:58:58 11
- Detail
-
iPhone 16 Debuts! Tmall Flagship Store's "More for the Same Price" Campaign Sparks Another Buying FrenzyDetail
2024-09-20 16:00:18 11
- Detail
- Detail
- Detail
-
Huawei's Tri-Fold Phone Gets "Bad Reviews": Chen Zhen Reviews with a Xiaomi Foldable and Says it's "Cool but I Probably Won't Use It Long-Term"Detail
2024-09-19 11:37:20 1
-
Python 3 Journey: 10 Lesser-Known Tips and Best Practices to Become a Better DeveloperDetail
2024-09-18 19:35:06 1
- Detail
- Detail
-
Is Buying a Phone Online Really Cheaper? A Physical Store Owner Reveals the "Inside Scoop": Stop Being Tricked!Detail
2024-09-18 16:46:11 1
- Detail
-
From a Stranger's Number to a Soul Mate: My Mobile Number "Inheritance" JourneyDetail
2024-09-16 03:06:20 11
-
Reproduction Under Weightlessness: How Can Humanity Perpetuate Civilization in Space?Detail
2024-09-15 23:18:12 11
- Detail
- Detail
-
41-Year-Old Academic President Passes Away, Leaving a 21-Character Message for His 4-Year-Old Son, Bringing Tears to Many Eyes!Detail
2024-09-15 15:21:49 1