Zhongguancun Initiates Achievement Transformation! Can manufacture 1nm chips!
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Emerging artificial intelligence applications, such as chat robots that generate human natural language, require more intensive and powerful computer chips. At present, the most advanced chip technology has reached 3 nanometers, but semiconductor chips are traditionally made of block materials, which are square 3D structures
Emerging artificial intelligence applications, such as chat robots that generate human natural language, require more intensive and powerful computer chips. At present, the most advanced chip technology has reached 3 nanometers, but semiconductor chips are traditionally made of block materials, which are square 3D structures. Therefore, stacking multiple layers of transistors to achieve more dense integration is very difficult.
However, semiconductor transistors made of ultra-thin two-dimensional materials, each with a thickness of only three atoms, can be stacked together to create more powerful chips. Therefore, research institutions including the United States and China are conducting in-depth research. Not long ago, we reported that researchers at MIT have now demonstrated a new technology (see: Chinese scientists lead! MIT creates three atom thick transistors) that can effectively and efficiently grow two-dimensional transition metal disulfide (TMD) material layers directly on fully manufactured silicon chips, achieving more dense integration.
In fact, China's progress in research in this field is also among the top in the world! I learned from the Zhongguancun Collaborative Fund official account yesterday that,The two-dimensional semiconductor material project that can manufacture 1nm chips has started to transform achievements in Zhongguancun!
The following content is reproduced fromZhongguancun Collaborative FundOfficial account:
The two-dimensional semiconductor material with atomic layer thickness represented by single-layer molybdenum disulfide can manufacture transistor devices beyond the 1nm technology node, so it is expected to continue Moore's law; At the same time, it can also achieve 3D heterogeneous integration with silicon based chips, overcome storage wall issues, and thus improve chip performance by thousands of times.
The two-dimensional semiconductor material preparation technology and equipment that our research team has been dedicated to researching for many years have transformed scientific and technological achievements, and Beijing Huoyan New Material Manufacturing Co., Ltd. has been established. This technology achievement transformation project has received support from Zhongguancun Patiently Capital. Zhongguancun Collaborative Innovation Fund, a subsidiary of Zhongguancun Development Group, has completed an exclusive angel round investment in Beijing Huoyan New Materials Manufacturing Co., Ltd. The financing will be used for the industrial research and development of two-dimensional semiconductor materials and equipment.
With the rapid development of artificial intelligence and mobile terminals, the requirements for high computing power and low energy consumption of chips are becoming increasingly high. Currently, traditional semiconductor materials are approaching their performance limits, and the new generation of semiconductor materials is highly anticipated by the scientific and industrial communities. 2D semiconductor materials are considered a new type of semiconductor material in the post Moore era, providing a new direction for continuing Moore's Law.
In a small laboratory near Wudaokou in Haidian District, several entrepreneurs are engaged in disruptive research and development in the field of two-dimensional semiconductor materials. An office, several world-class high-precision scientific instruments, and R&D personnel are fully invested. People's imagination of the entrepreneurial scene of scientists is precisely the reality here.
The founder and chief scientist of the company, Xie Liming, obtained a doctoral degree from Peking University and has experience in MIT visiting research and Stanford University postdoctoral research, focusing on two-dimensional semiconductor materials research. The entrepreneurial team members he leads have rich academic background and research experience in two-dimensional material manufacturing and equipment research and development. Their startup company Beijing Huoyan New Materials Manufacturing Co., Ltd. was established in 2022, focusing on the research and development and manufacturing of two-dimensional semiconductor materials and growth equipment, as well as wafer testing equipment.
Wafer detection equipment
Xie Liming, founder of Huoyan New Materials, introduced high-temperature in-situ imaging growth equipment to Sun Cisuo, chairman of Collaborative Fund
The core technology has reached a global leading level
Sales application of some products
When it comes to semiconductors, Moore's law is indispensable. This empirical law of semiconductors states that the number of transistors that can be accommodated on an integrated circuit doubles every approximately 18 to 24 months. However, due to the small size of transistors, it is becoming increasingly difficult for current silicon based technologies to further reduce the size, which poses a huge challenge in continuing Moore's law.
2D semiconductor materials have atomic layer thickness and are expected to continue Moore's Law and achieve silicon based 3D heterojunction integration, thus having enormous application potential in fields such as electronic chips and optoelectronic chips. 2D semiconductor materials provide more than three orders of magnitude of improvement space for chip performance, and have currently become the focus of research and development institutions in various countries, "Xie Liming said, The core business of Beijing Huoyan New Material Manufacturing Co., Ltd. is two-dimensional material manufacturing and proprietary equipment for material manufacturing/testing. It has multiple independently developed core technologies and patents, and unique high-temperature in-situ imaging technology and liquid phase epitaxy technology, which can achieve in-situ quality control during the two-dimensional material manufacturing process. Currently, the liquid phase edge epitaxy method has been used to obtain full single-layer epitaxy. This technology is at a leading level globally and provides critical support for the high-quality manufacturing of two-dimensional semiconductor materials.
FE-900Wafer detection equipment
The application market of two-dimensional semiconductor materials has reached hundreds of billions
Broad future market
Scientists start businesses and sharpen their swords in ten years. Xie Liming is leading his team to focus on the forefront of technological development, dedicated to research and development, and committed to becoming a leader in the manufacturing of two-dimensional semiconductor materials and equipment. He will work together with research institutions and semiconductor enterprises to achieve demonstration and verification of prototype chips based on two-dimensional semiconductor materials, as well as demonstration and verification of heterogeneous integrated chips with silicon chips.
38Wafer detection equipment
The Collaborative Fund will continue to provide comprehensive post investment services, while utilizing its own brand and industry resources to help projects expand their industrial influence and develop industry clients, assisting projects and partners to jointly create a new chapter in the field of two-dimensional semiconductor materials, injecting new vitality into the future technological revolution.
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